By O. Yano, A. Kimoto, H. Yamaoka (auth.), Leonard T. Summers (eds.)

The 1995 foreign Cryogenic fabrics convention (lCMC) used to be held on the better Columbus conference heart in Columbus, Ohio, at the side of the Cryogenic Engineering convention (CEC) on July 17-21. The interdependent matters of the 2 meetings attracted greater than 8 hundred individuals, who got here to percentage the most recent advances in low-temperature fabrics technology and know-how. additionally they got here for the real through items of the meetings: id of recent study parts, of collaborative examine chances, and the institution and renewal of exploration specialist relationships. Ted Collings (Ohio country University), as Chairmen of the 1995 ICMC; Ted Hartwig (Texas A&M University), as software Chairman; and twenty-one different application Committee individuals expertly prepared the ICMC technical classes and comparable actions. The contributions of the CEC board and its convention Chairman James B. Peeples of CVI, Inc., have been valuable to the good fortune of the 11th CEC/ICMC. Jeff Bergen of Lake Shore Cryogenics served as shows Chairman. neighborhood preparations and convention administration have been expertly dealt with lower than the counsel of Centennial meetings, Inc. Skillful tips with modifying and coaching ofthese lawsuits was once supplied by means of Ms. Vicky Bardos ofSynchrony, Inc.

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The silica dispersed without a coupling agent (open squares in the figure) show a largcr fracturc toughness at RT, whereas at LNT and LHcT they have a smaller toughncss than that of epoxy. 25wt% 1 atm. 20 atm. 6 Relationship hetwcen Viekers hardncss and '3" outside epoxy moleeules was attributed. In eoupling agent eontaining system, howeveL the fmeture toughness did not deerease from LNT to LHeT. 6 times compared with that of epoxy. This improvement should be attributed to the introduction of unoceupied spaee inside epoxy moleeules.

The figures attached to the Klc-values signity the number of crack arrests occuring during a complete experiment. K ic of PMMA is nearly constant over the whole range of the COD rate. The number of crack arrest steps also shows no systematic dependence on the strain rate. For PC, however, the influence ofthe COD rate on K\c is obvious. At very high strain rates only small values of K\c result, whereas at low strain rates K ic increases by more than a factor oftwo. This etTect is probably due to an orientation ofthe polymer chains at the crack tip at low deformation rates.

The eu ring agent was mixed ,md thc system was pre-eured al 3(l3K fOT 2 hours and post-eured at 423K for 2 hours. In order to shrink the unoccupied spaee introduccd by dispersing silica filler the system was also eured al 20 alm. The amounl of the silica was ehanged. The coupling agent was used to erosslink silica and epoxy molecules. The coupIing agent used was N- ß aminoethyl- r aminopropyl-methyldimethoxy-silane. 2. 9 wt% constant, the amount of coupling agent was changed. The amount of eoupling agent was small and hence the weight fraction of silica was not affeeted by the coupling agent.

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